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BondaTek carries full range of FZ and CZ silicon wafers, the specifications and parameters comply with SEMI standards.
Silicon on insulator (SOI) wafers are a three layer material stack composed of the following: an active layer of prime quality silicon (DEVICE LAYER) over a buried layer (BOX) of electrically insulating material (like silicon dioxide, sapphire, silicon nitride, etc), over a bulk silicon support wafer (HANDLE LAYER).
BondaTek provides Ge, GaAs, GaP, GaN, GaSb, InP, InAs, InSb wafers to micro- electronics and optoelectronics industry in diameter range from 2" to 4" with orientation<100> or <111>, EPD< 5000 cm-2 and epi ready surface.
GlassWafers??Material JGS1 Schott Lithotec Q1 Heraeus SUPRASIL 1, 2, 3 Lithium tetraborate, Li2B4O7
The initial product is considered “beta” because additional refinements in the production process are being made. The amounts of boron and hexagonal-boron nitride (h-BN) present in the material are being adjusted while optimizing for BNNT.
Sputtering Targets: Metal sputtering targets, Alloy sputtering targets, Ceramic sputtering targets